PCB Assembly Capability

The information below details some of the key capabilities that JEC can offer and support for PCB assembly. You will find information below relating to assembly types and technologies that we can supportThe information below details some of the key capabilities that JEC can offer and support for PCB assembly. You will find information below relating to assembly types and technologies that we can support.

 

Assembly Type:

SMD / THD / Mixed (SMD/THD) / Single or double sided placement

Solder Types:

Leaded/ Lead free/ No Clean process available

Stencils:

Laser cut stainless steel

Component Type:

  • BGA (As small as 0.35mm pitch)
  • Fine pitch (as small as 15 mil pitch)
  • Passive component (as small as 0402 packages)

Test:

  • AOI
  • ICT